Manual Final Visual Inspection System
TY-VISION M100S
Capable of testing high-resolution boards such as package boards and module boards.
| Applicable boards |
Gold plated, copper flux, solder-leveler printed |
| Max. board dimensions |
200(W)×300(L)mm |
| Optical resolution |
Fixed: 5 to 20 µm/pixelSelectable: 5 to 10 µm |
| CCD camera |
7,450-pixel, B/W line sensor |
| Lighting |
Halogen or fluorescent lamp |
| PC specification |
OS:Windows2000 CPU：Pentium4, 3Ghz and over Memory:2GB |
| Software |
Adln Scope general-purpose board test module |
| Main checking functions |
Pattern matching, DRC, shape check, etc. |
| Defects to be detected |
Gold (copper) pad: Contamination, foreign matter, scratch, missing pad, discoloration, cracked bump, dentResist surface: Pad on misaligned resist, foreign matter, deep cut, exposed copper, etc. |
| Option |
Laser marking sorter |
