Double-sided Automatic Final Visual Inspection System
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| Applicable boards | Gold plated, copper flux, solder-leveler printed |
| Max. board dimensions | 150(W)×250(L)mm 200×300 |
| Optical resolution/td> | 3 to 8 µm (selectable), 5 to 10 µm (selectable), 3 to 20 µm (fixed) |
| CCD camera | 7,450(7,400)-pixel, B/W line sensor |
| Lighting | Halogen or fluorescent lamp |
| PC specification | OS:Windows2000 CPU:Pentium4, 3Ghz and over Memory:2GB |
| Software | Adln Scope general-purpose board check module |
| Main checking functions | Pattern matching, DRC, shape check, etc. |
| Defects to be detected | Gold (copper) pad: Contamination, foreign matter, scratch, missing pad, discoloration, cracked bump, dent Resist surface: Pad on misaligned resist, foreign matter, deep cut, exposed copper, etc. |
| Options | Handling of laminated paper Clean mechanism (clean roller / air blow) Loading/unloading cassette rack |