Electroforming
Electroforming is applied to the manufacture of plated metal products of high dimensional accuracy that cannot be made by etching or precision milling. The electroformed products from Taiyo Industrial combine lithographic and plating technologies on a high plane, as follows.
Features
- Tiny holes that are hard to make by etching can be formed.
- Dimensions can be controlled on the micron order.
- Columnar structures can be formed.
- Two cross-sectional profiles are available: overhang and straight.
- Molds are unnecessary, so initial investment is low.
- Suited for flexible production of small quantities in wide varieties
Uses
Medium control nozzles, micro particle filters, optical slit panels, metal masks for printing, masks for metal screen deposition, MEMS parts, etc.
General Specifications
|
Overhang type |
Straight type |
General |
Special |
Max. work dimensions |
400mm×300mm |
400mm×300mm |
50mm×50mm |
Min. hole diameter |
10µm |
20µm |
5µm |
Dimensional accuracy |
±5µm ※1 |
±5µm ※1 |
±1µm ※2 |
Applicable plate thickness |
10 to 100µm |
10 to 200µm |
5 to 25µm |
Aspect ratio |
- |
0.5 to 1.2 |
0.5 to 3 |
Secondary plating reinforcement |
Available |
Available |
Available |
Plating material |
Ni |
Ni,Ni-Co,Cu |
Ni,Ni-Co,Cu |
*1 Film mask used / *2 Chrome mask used
*Final specifications will differ according to processing pattern, photo mask, etc.

Flat specification
This method processes products on flat materials. Both overhang and straight profile cross-sections can be formed.
Cylinder specification
This method is suited for ultra-precision processing that requires high dimensional accuracy (±1 µm). It is used for semi-additive FPC circuits and MEMS products. A straight cross-sectional profile is used.
UV-LIGA applied specification
This method further develops the high precision specification by enabling high accuracy, high aspect processing. Though currently under development, applications are expected with previously mentioned MEMS products and molds for nano-imprinting. A straight cross-sectional profile is used.