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Electroforming is applied to the manufacture of plated metal products of high dimensional accuracy that cannot be made by etching or precision milling. The electroformed products from Taiyo Industrial combine lithographic and plating technologies on a high plane, as follows.


  • Tiny holes that are hard to make by etching can be formed.
  • Dimensions can be controlled on the micron order.
  • Columnar structures can be formed.
  • Two cross-sectional profiles are available: overhang and straight.
  • overhang and straight
  • Molds are unnecessary, so initial investment is low.
  • Suited for flexible production of small quantities in wide varieties


Medium control nozzles, micro particle filters, optical slit panels, metal masks for printing, masks for metal screen deposition, MEMS parts, etc.

General Specifications

  Overhang type Straight type
General Special
Max. work dimensions 400mm×300mm 400mm×300mm 50mm×50mm
Min. hole diameter 10µm 20µm 5µm
Dimensional accuracy ±5µm ※1 ±5µm ※1 ±1µm ※2
Applicable plate thickness 10 to 100µm 10 to 200µm 5 to 25µm
Aspect ratio - 0.5 to 1.2 0.5 to 3
Secondary plating reinforcement Available Available Available
Plating material Ni Ni,Ni-Co,Cu Ni,Ni-Co,Cu

*1 Film mask used / *2 Chrome mask used
*Final specifications will differ according to processing pattern, photo mask, etc.

Flat specification

Flat specification

This method processes products on flat materials. Both overhang and straight profile cross-sections can be formed.

Cylinder specification

High precision specification

This method is suited for ultra-precision processing that requires high dimensional accuracy (±1 µm). It is used for semi-additive FPC circuits and MEMS products. A straight cross-sectional profile is used.

UV-LIGA applied specification

UV-LIGA applied specification (Under development)

This method further develops the high precision specification by enabling high accuracy, high aspect processing. Though currently under development, applications are expected with previously mentioned MEMS products and molds for nano-imprinting. A straight cross-sectional profile is used.