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UV-LILGA applied specification processing example

High aspect honeycomb mesh

The UV-LIGA Process enables the LIGA process that uses radiated light from a giant synchrotron, with ultra violet (UV) light. With it, micro structures of high aspect ratio can be made comparatively easily on general equipment.

仕様
Plating thickness 60µm
Rib width 10µm
Mesh opening rate Approx. 90%
Aspect ratio 6
高アスペクトハニカムメッシュ

Improved aspect ratio of micro flow channel circuit

Plating thickness can be increased for the micro flow channel circuit listed in the special specification, while keeping the straight profile of the sidewall.

仕様
Plating thickness 75µm
Micro flow channel 30/30µm
Aspect ratio 2.5
Plating metal Nickel
マイクロ流路回路