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High precision specification processing examples

Semi-additive FPC

Semi-additive FPCs are being developed via electroforming as FPC boards of increasingly higher mounting density and precision. Applications have emerged in state-of-the-art mounting fields.

Pitch 10µm
Circuit width 5µm
Circuit thickness 10µm
Plating metal Copper
Semi-adaptive FPC

MEMS products

The high precision and detail found with electroforming are being used to develop micro flow channel arrays, micro mixers and micro gears for MEMS products.

Plating thickness 25µm
Micro flow channel 30/30µm
Plating metal Copper