High precision specification processing examples
Semi-additive FPC
Semi-additive FPCs are being developed via electroforming as FPC boards of increasingly higher mounting density and precision. Applications have emerged in state-of-the-art mounting fields.
| Pitch |
10µm |
| Circuit width |
5µm |
| Circuit thickness |
10µm |
| Plating metal |
Copper |
MEMS products
The high precision and detail found with electroforming are being used to develop micro flow channel arrays, micro mixers and micro gears for MEMS products.
| Plating thickness |
25µm |
| Micro flow channel |
30/30µm |
| Plating metal |
Copper |
